陶瓷立体封装结构微组装工艺研究  

Research on Micro-Assembly Process of Ceramic Three Dimensional （3D） Packaging Structure

作　　者：张柯 刘牛[1] 孙函子[1] 王宁[1] 周婷[1] 潘园园 ZHANG Ke;LIU Niu;SUN Han-zi;WANG Ning;ZHOU Ting;PAN Yuan-yuan(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2018年第2期30-34,共5页Hybrid Microelectronics Technology

摘　　要：本文研究了一种利用混合集成电路技术实现的陶瓷封装立体结构的组装工艺。研究了该产品组装可能面对的问题，提出了相应的解决方案。建立了三维模型，通过有限元分析软件完成组装方案分析。研究了该产品的立体组装工艺流程及方法．探讨了此类封装结构及组装工艺的可靠性及未来发展。This work focus on the micro-assembly technology of a ceramic 3D packaging structure. The problenls in the process are studied and solutions are proposed. The work of analysis of random vibration is realized by FEA soft- ware. The three dimensional assembly process and method of the product are studied, and the reliability and future development of such package structure and assembly process are discussed.

关 键 词：陶瓷管壳 立体封装 有限元分析 微组装 

分 类 号：TN605[电子电信—电路与系统]