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作 者:冯爱军 朱雨生[1] FENG Ai-jun;ZHU Yu-sheng(No.43 Research Institute of CETC,Hefei 230088,China)
机构地区:[1]中国电子科技集团公司第43研究所,合肥230088
出 处:《混合微电子技术》2018年第2期35-38,43,共5页Hybrid Microelectronics Technology
摘 要:本文介绍了厚膜混合集成电路国内外发展现状。通过对军品多品种、小批量订单特点进行系统分析,识别出订单的变量要素,通过将订单划分不同的阶段,识别出多个订单不同阶段的共性内容,以此为基础,探索建立一种MOTS(Military-off-the-shelf:军用货架即定制或者开发的军用货架)体系。通过调整部分交付条件实现了对军品复杂订单的大批量交付。并在中国电科某研究所进行了实践探索。This paper introduces the development status of thick film hybrid integrated circuit in domestic and foreign country. Through systematic analysis on the characteristics of military products and small batch orders, the production factors of orders were identified. Divided by the order of different phases, identify multiple orders at different stages of common content, on this basis, to establish a system of MOTS (Military-off-the-shelf: military spot can be customized or developed for military spot). The bulk delivery of military orders is achieved by changing partial delivery conditions. In addition, a practical exploration was carried out in a research institute of CETC.
分 类 号:TN45[电子电信—微电子学与固体电子学]
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