晶圆激光划片技术简析  

Laser Dicing Technique Analysis for Wafer

作　　者：高爱梅[1] 张永昌 邓胜强 GAO Aimei;ZHANG Yongchang;DENG Shengqiang(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2018年第5期26-30,共5页Equipment for Electronic Products Manufacturing

摘　　要：针对晶圆划片工艺,分析了激光半划、激光全划、激光隐形划切和异形芯片的划切等工艺方法的特点。结合典型试验案例,提供了每种划片方式的适用领域,对晶圆划片具有一定的工艺参考价值。Aiming at wafer dicing technics, this paper analyzes technics characteristic of laser half-dicing, laser full-dicing and laser stealth dicing. Fall together some typical test cases, provides the appropriate application field of each dicing method. It may be of reference value to wafer dicing.

关 键 词：晶圆划片 激光划片 半划 全划 

分 类 号：TN305.1[电子电信—物理电子学]