晶圆针测针痕异常问题分析和改善方法  

Abnormal Problem Analysis and Improvement of Chip Probe Test Trace

作　　者：王菲[1] 裴仁国 黄芝花[1] 邹巧云[1] WANG Fei;PEI Renguo;HUANG Zhihua;ZOU Qiaoyun(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2018年第A01期76-80,共5页Electronics & Packaging

摘　　要：介绍了集成电路晶圆针测经常出现的两种针痕异常问题。针对异常问题发生的原因、对测试的影响进行了探讨，并提出了针对这几种异常问题的改善方法。通过从人、机、料、法等方面采取措施来控制异常问题的发生，从而确保晶圆测试的良品率，并提高产品测试结果的准确性、可靠性和可信度。Two kinds of abnormal chip probe test are mtroauceci m mls paper., ~uuu~ e, abnormal problems and their effects on testing, some improvement methods for these abnormal problems are put forward. By taking measures from the aspects of human, machine, material and method to control the occurrence of abnormal problems, the good rate of wafer testing is ensured and the accuracy, reliability and reliability of the product test results are improved.

关 键 词：晶圆针测 针迹偏移 针迹过深 改善 

分 类 号：TN307[电子电信—物理电子学]