含铋焊料的板级可靠性研究  

Research on Board Level Reliability of Bismuth-containing Solder

作　　者：谢鑫[1] 金大元[1] 万云[1] XIE Xin;JIN Da-yuan;WAN Yun(The 36th Research Institute of CETC,Jiaxing 314033,China)

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《电子机械工程》2018年第5期42-45,共4页Electro-Mechanical Engineering

摘　　要：为确认某型含铋焊料球CBGA的可靠性,并依据焊料特性制定合适的焊接工艺,文章通过对印制板焊点的检查、测试,对比了锡铅焊料、含铋焊料(Sn46Pb46Bi8)的剪切力、合金元素分布、IMC层状态,观察了老化试验前后含铋焊料焊点剪切力、合金元素分布、IMC层状态的变化。研究表明含铋焊料各方面性能与锡铅焊料相当,老化试验后焊点性能未发生严重衰减。文章最后依据Sn46Pb46Bi8焊料特性,修改了CBGA焊盘设计、优化了焊接工艺。In order to confirm the reliability of a bismuth-containing solder ball CBGA,establish a suitable soldering process according to the solder characteristics,through the inspection and testing of printed board solder joints,the paper studies the shear force,alloy element distribution and IMC layer state of tin-lead solder and bismuth-containing solder（Sn46 Pb46 Bi8）. The shear force of the solder joints,the distribution of alloying elements,and the state of the IMC layer before and after the aging test were observed. Studies have shown that the performance of all aspects of bismuth-containing solder is comparable to that of tin-lead solder,and the solder joint performance after aging test has not been seriously attenuated. At the end of the article,according to the Sn46 Pb46 Bi8 solder characteristics,the CBGA pad design was modified and the soldering process was optimized.

关 键 词：铋焊料 CBGA Sn46Pb46Bi8 焊接工艺 

分 类 号：TN405[电子电信—微电子学与固体电子学]