模式识别在半导体器件封装中的应用  

Application of pattern recognition inenclapse of semiconductor device

作　　者：冯新勇[1] 袁新峰[1] 

机构地区：[1]四川大学电子信息学院,四川成都610064

出　　处：《半导体技术》2002年第11期58-60,共3页Semiconductor Technology

摘　　要：主要介绍了半导体器件封装SOT-23中所用的基本的模式识别技术-模板匹配法。以及模式识别的基本概念和一般框图、SOT-23半导体封装的流程。通过对基本知识的介绍以期能够找到这两种技术的结合点,并介绍了我国目前半导体工业的现状。The article introduces mainly the basic technology of pattern recognition-templatematching method-in SOT-23 semiconductor device enclapse including the principles of pattern rec-ognition and the process of semiconductor device capsulation.The author intends to find thecorrelections of the two kinds of technologies by the basic principles, the development of semicon-ductor industory in our country at present is given also .

关 键 词：模式识别 半导体器件 封装 模板匹配 划片 粘片 

分 类 号：TN305.94[电子电信—物理电子学]