IGBT制造工艺中的APCVD设备改进研究  

Research on Improvement of APCVD Equipment in IGBT Manufacturing Process

作　　者：傅轶 FU Yi(Advanced Semiconductor Manufacturing Corporation, Shanghai 200233, China)

机构地区：[1]上海先进半导体制造股份有限公司,上海200233

出　　处：《集成电路应用》2017年第8期56-58,共3页Application of IC

基　　金：上海市科学技术委员会科技创新行动计划高新技术基金(17DZ1100300)

摘　　要：采用新的备件清洗和管理方式,降低offline和inline存在的particle和defect,提高产品line yeild,并研究常压化学气相淀积(APCVD)设备系统存在稳定性差,均匀性差等特点,合理使用设备和备件,增加设备保养周期内的出片率,降低产品缺陷和设备维护成本的方法,并解决产能瓶颈的问题。The spare parts cleaning and new management would reduce the particle and defect of offline and inline,and improve the line yeild of products.The system of atmospheric chemical vapor deposition(APCVD)is characterized by poor stability and poor uniformity.The rational use of equipment and spare parts would increase the rate of production during the equipment maintenance cycle,to reduce product defects and equipment maintenance costs and to solve the problem of capacity bottlenecks.

关 键 词：集成电路制造 IGBT 常压化学淀积 APCVD Particle VPD 

分 类 号：TN405[电子电信—微电子学与固体电子学]