时效对Sn-0.7Cu-0.05Ni-xSm/Cu焊点界面与抗剪强度的影响  

Effect of aging on interface and shear strength of Sn-0.7Cu-0.05Ni-xSm/Cu joint

作　　者：李丹[1] 孟工戈[1] 康敏[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040

出　　处：《焊接学报》2017年第12期104-108,共5页Transactions of The China Welding Institution

摘　　要：以Sn-0.7Cu-0.05Ni-xSm/Cu焊点为对象(元素Sm含量分别为0,0.025,0.05,0.1和0.2(质量分数,%)),研究焊后与经过160℃,24,96和360h时效后,焊点界面金属间化合物(IMC)与抗剪强度的变化.结果表明,在钎料中未添加稀土元素Sm时,IMC层凹凸不平;加入微量元素Sm,IMC层变的平坦顺滑.时效会使IMC不断长大,其界面形貌由原始的扇贝状向平直均匀的层状转变.元素Sm含量在0.025%~0.1%范围内时,不论时效前还是时效后,IMC层较薄.元素Sm对界面IMC的生长有抑制作用,有益于提高焊点的可靠性.加入微量稀土元素Sm以后,焊点抗剪强度发生了变化.不论时效前还是时效后,当元素Sm含量为0.025%时,焊点抗剪强度都是最高.Sn-0.7Cu-0.05Ni-xSm/Cu joints were made with 0,0.025,0.05,0.1 and 0.2 wt% of Sm content respectively. The change of interfacial intermetallic compounds(IMC)and shear strength were investigated after soldering and aging at160 ℃ for 24,96,360 h,respectively. The results showed that IMC layer rugged with no Sm in the solder,while it became flat and smooth with addition of Sm. IMC layer grew continuously during aging,and its morphology turned from originally scalloped to flat and uniform. Whether before or after aging,the IMC layer was thinner when Sm content was between 0. 025 ~ 0. 1%. The addition of Sm suppressed the growth of interfacial IMC,benefit for the joint reliability. The shear strength of joint changed with the addition of Sm in solder. The shear strength of joint was highest when Sm content was 0. 025%.

关 键 词：时效 Sn-0.7Cu-0.05Ni-xSm/Cu焊点 界面金属间化合物 抗剪强度 

分 类 号：TG425.1[金属学及工艺—焊接]