BGA单板结构与板级结构焊点剪切力学行为分析  

Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure

作　　者：贾克明 王丽凤[1] 张世勇 刘海涛[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040

出　　处：《焊接学报》2018年第3期94-98,共5页Transactions of The China Welding Institution

基　　金：黑龙江省自然科学基金(E201449)

摘　　要：采用试验方法研究BGA封装结构中焊点的剪切力学行为.分析并比较了Sn-3Ag-0.5Cu,Sn-0.3Ag-0.7Cu,Sn-0.3Ag-0.7Cu-0.07La和Sn-0.3Ag-0.7Cu-0.07La-0.05Ce四种钎料焊点在单板结构与板级结构中的力学性能.结果表明,单板结构中焊点的抗剪强度高于板级结构中焊点的抗剪强度.在单板结构中,高银焊点的抗剪强度最大,加入稀土元素的低银焊点只是得到了一定程度上的改善,然而对于板级结构,加入稀土元素的低银焊点剪切力学性能基本与高银焊点相当.在同等拘束条件下,低银焊点的延展性优于高银焊点.此外,对于同一种钎料而言,单板结构中的焊点断裂在体钎料上,而板级结构则断裂在IMC/体钎料界面处.The shear behavior of solder joints in BGA package structure is studied by shear experiments. The mechanical properties of four solder joints with Sn-3 Ag-0. 5 Cu, Sn-0. 3 Ag-0. 7 Cu,Sn-0. 3 Ag-0. 7 Cu-0. 07 La and Sn-0. 3 Ag-0. 7 Cu-0. 07 La-0. 05 Ce in the veneer and board-level structure were compared and analyzed. The results show that the shear strength of the solder joints in veneer structure is higher than that of the solder joints in board-level structure. The shear strength of the high-silver solder joints is the largest and the low-silver solder joint with rare earth element has been improved to a certain extent in veneer structure. However,the shear mechanical proper-ties of low-silver solder joints with rare earth elements are basically equivalent to those of high-silver solder joints in board-level structure. The ductility of the low-silver solder joints is better than that of the high-silver solder joints under the same constraint conditions. In addition,for the same solder,the joints in veneer structure fracture in the bulk solder,and the joints in board-level structure fracture at the interface of the IMC and bulk solder.

关 键 词：BGA 剪切性能 单板结构 板级结构 

分 类 号：TG454[金属学及工艺—焊接]