芯片组装的失效机理及分析  

Failure Mechanism and Analysis of Chip Assembly

作　　者：贺玲 刘洪涛 HE Ling;LIU Hongtao(The 47th Research Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)

机构地区：[1]中国电子科技集团公司第四十七研究所,沈阳110032

出　　处：《微处理机》2018年第2期5-7,共3页Microprocessors

摘　　要：介绍了几种有代表性的芯片组装模式,并结合实例详细探讨了由多种不同原因导致的几种焊接与粘接的失效模式。针对不同失效模式的特点,对芯片在粘接或焊接过程中可能会在不同部位、以不同形式出现的脱落、脱焊与断裂等,提出多种不同的检测手段。以最大程度避免出现组装失效为目的,剖析具体的粘接焊接原理与失效机制。在符合国家标准的常规生产检测之外,对改进芯片组装质量的方法进行了深入的延伸讨论。Several typical chip assembly modes are introduced,and several failure modes of bonding and welding caused by many different reasons are discussed in detail with examples.According to the characteristics of different failure modes,this paper puts forward a variety of different detection methods for the chip falling off,desoldering and fracture which maybe happens in different parts and in different forms during the process of bonding or welding.In order to avoid assembly failure to the greatest extent,the principle and failure mechanism of bonding and welding were analyzed.In addition to the routine production inspection in accordance with the national standards,the methods of improving the quality of chip assembly are discussed in depth.

关 键 词：芯片粘接 焊接 芯片组装 粘接强度 失效 失效模式 可靠性 

分 类 号：TN47[电子电信—微电子学与固体电子学]