波峰焊对BGA焊点的影响  

Influence of Wave Soldering on BGA Solder Joint

作　　者：黄智丹 张森 许永号 郭丽鹃 HUANG Zhi-dan;ZHANG Sen;XU Yong-hao;GUO Li-juan(School of Electrical and Control Engineering,North China Institute of Aerospace Engineering,Langfang,Hebei 065000,China)

机构地区：[1]北华航天工业学院电子与控制工程学院,河北廊坊065000

出　　处：《新型工业化》2018年第7期68-72,共5页The Journal of New Industrialization

基　　金：河北省研究生创新资助项目(CXZZSS2018161);河北省北华航天工业学院硕士研究生创新项目(YKY-2016-04)

摘　　要：在电子装联混装工艺中,由于波峰焊焊接过程的温度梯度较大,BGA芯片经历这一焊接过程时会受到热冲击,导致其焊点易开裂;同时,较高温度的熔融焊料(一般在230℃以上)与印制板组件直接接触,易造成BGA焊点的二次熔融现象。本文以波峰焊对BGA焊点的影响为研究目的,根据回流焊和波峰焊的焊接原理,通过金相分析实验与ANSYS仿真相结合的方法,对经历过波峰焊焊接过程的BGA芯片进行分析,以验证BGA焊点经历波峰焊焊接过程后是否会产生开裂和二次熔融现象。In the mixing process of electronic assembly,because of the temperature varies greatly in the process of wave soldering,the BGA chip will be subjected to thermal shock during this welding process,which causes the solder joint to crack easily.At the same time,the direct contact between PCB components and molten solder at a higher temperature(usually above 230℃)can cause the two melting phenomenon of BGA solder joints.The purpose of this paper is to study the effect of wave soldering on BGA solder joint.According to the principle of reflow and wave soldering,through the combination of metallographic analysis and ANSYS simulation,the BGA chip after the wave soldering process has been analyzed to verify whether the BGA solder passes through the wave peak welding process to produce two melting and cracking phenomena.

关 键 词：BGA 回流焊 波峰焊 金相分析 ANSYS仿真 

分 类 号：TG454[金属学及工艺—焊接]