微波印制电路引线镀金厚度均匀性的改善  

Improvement of thickness uniformity of gold coatings electroplated on the leads of microwave printed circuits

作　　者：戴广乾[1] 曾策[1] 边方胜[1] 许冰 闵显超 林玉敏[1] 陈全寿[1] DAI Guang-qian;ZENG Ce;BIAN Fang-sheng;XU Bing;MIN Xian-chao;LIN Yu-min;CHEN Quan-shou(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电镀与涂饰》2018年第15期687-693,共7页Electroplating & Finishing

摘　　要：通过采用整体包胶、结构可调的电镀夹具,将待镀微波印制电路片表面调整至与阳极平行,并令镀液温度和电流密度分别由52°C和0.15 A/dm^2升至60°C和0.30 A/dm^2,改善了引线镀金厚度的均匀性,厚度均匀性系数(COV)由原来的20%~25%降至11%以下,制程能力指数(CPK)由0.65提升至2.10以上。The thickness uniformity of gold coatings electroplated on the leads of microwave printed circuits was improved by using adjustable and entirely rubberized clamps which were able to make the surface of circuit board parallel to the anode surface,raising bath temperature from 52°C to 60°C,and increasing current density from 0.15 A/dm2 to 0.30 A/dm2.The uniformity of gold coating thickness characterized by the coefficient of variation(COV)was decreased from 20%-25%to 11%below,and the complex process capability index(CPK)was increased from 0.65 to 2.10 above.

关 键 词：微波印制电路 电镀金 厚度均匀性 夹具 制程能力指数 

分 类 号：TQ153.18[化学工程—电化学工业]