高速光器件封装技术发展趋势  

Development Trend of High-Speed Optical Device Packaging Technology

作　　者：张一鸣[1,2] 刘宇 张志珂[3] ZHANG Yiming;LIU Yu;ZHANG Zhike(Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China;University of Chinese Academy of Sciences,Beijing 100049,China;Peking University,Beijing 100871,China)

机构地区：[1]中国科学院半导体研究所,北京100083 [2]中国科学院大学,北京100049 [3]北京大学,北京100871

出　　处：《中兴通讯技术》2018年第4期46-50,共5页ZTE Technology Journal

摘　　要：针对5G应用场景,高速光模块起着重要的作用,其设计、制备和封装受多方面的因素限制。就封装这一因素对光模块高频特性的影响进行了详细分析,并提出了3种不同维度的设计方案。基于此,针对性地开发了3种符合应用标准的高速光模块。认为在未来大规模、高密度、高速率光电集成器件中,封装技术将会朝着多维度、多形态的方向发展。High-speed optical module plays an important role in 5G application scene,and its design,fabrication and packaging are affected by many factors.In this paper,the influence of high-frequency characteristics of the optical module induced by packaging is analyzed in detail,and three different dimensions of the design scheme are proposed.Then three kinds of high-speed optical modules conforming to the application standard have been developed.It is considered that in the future,the packaging technology will be developed in the direction of multi-dimension and multi-form in the large scale,high density and high rate optoelectronic integrated devices.

关 键 词：三维封装 高速直调激光器 单片集成外调激光器 多波长激光器 

分 类 号：TN405[电子电信—微电子学与固体电子学]