电子封装中Cu/Sn/Cu焊点组织演变及温度对IMC立体形貌影响  

Microstructural evolution of Cu/Sn/Cu joints and effect of temperature on three-dimensional morphology of IMCs in packaging technology

作　　者：梁晓波[1] 李晓延[1] 姚鹏[1] 李扬[1] LIANG Xiaobo;LI Xiaoyan;YAO Peng;LI Yang(College of Materials Science and Engineering,Beijing university of technology,Beijing 100124,China)

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《焊接学报》2018年第9期49-54,131,共7页Transactions of The China Welding Institution

基　　金：国家自然科学基金(5157011);北京市自然科学基金(2162002)

摘　　要：通过电镀的方法在抛磨好的铜基体沉积4μm的锡层,并组合成一个Cu/Sn/Cu结构.分别选择240℃、1 N作为钎焊温度和钎焊压力,在不同的钎焊时间下制备焊点,分析了Cu/Sn/Cu焊点组织演变规律.分别制备了不同钎焊温度下(240,270,300℃)Cu_6Sn_5和Cu_3Sn的立体形貌,分析了温度对Cu_6Sn_5和Cu_3Sn立体形貌的影响规律.结果表明,钎焊30 min后Cu_6Sn_5为平面状,随着钎焊时间的增加逐渐转变成扇贝状.在扇贝底部的Cu_3Sn要比扇贝两侧底部的Cu_3Sn厚.增加钎焊时间锡不断被反应,上下两侧Cu_6Sn_5连成一个整体.继续增加钎焊时间Cu_6Sn_5不断转变成为Cu_3Sn.随着钎焊温度的升高Cu_6Sn_5的立体形貌逐渐由多面体状转变成匍匐状,而Cu_3Sn晶粒随着钎焊温度上升不断减小.A 4μm thick Sn film was deposited on the copper substrate by electroplating.Two copper substrates with electroplated Sn were constituted of a Cu/Sn/Cu structure.240°C and 1 N were chosen as soldering temperature and pressure to be soldered for different time to investigate the law of microstructural evolution of IMCs.The three-dimensional morphology of Cu6Sn5 and Cu3Sn under different soldering temperature(240,270,300°C)were fabricated,Investigate the effect of temperature on three-dimensional morphology.The results show Cu6Sn5 was planar after soldered for 30 min and turned into scallop-like with the increase of soldering time.Cu3Sn in the bottom of scallop was thicker than that in bottom of scallop on both sides.Sn was reacted with the increase of soldering time,Cu6Sn5 in the two side merged into a whole gradually.Increase more soldering time,Cu6Sn5 continued to be transformed into Cu3Sn.The three-dimensional of Cu6Sn5 transformed from polyhedron shape to procumbent and the size of Cu3Sn grains decreased gradually with the increase of soldering temperature.

关 键 词：Cu/Sn/Cu焊点 Cu3Sn Cu6Sn5 组织演变 立体形貌 

分 类 号：TG454[金属学及工艺—焊接]