三维X射线检测技术在倒装焊器件中的应用  

Application of 3D X ray detection technology in flip chip device

作　　者：王爽 Wang Shuang(China Institute of electronic technology standardization,Beijing,100176)

机构地区：[1]中国电子技术标准化研究院,北京100176

出　　处：《电子测试》2018年第24期31-32,21,共3页Electronic Test

摘　　要：倒装焊器件具有互联密度高、频率特性好等优点,近年来得到迅速发展和广泛应用。倒装凸点和BGA焊球的质量对于器件的可靠性影响很大。X射线无损检测技术是检查器件封装内部缺陷的有效手段。本文在对倒装焊器件基本结构和工艺分析的基础上,讨论了倒装焊器件常见的缺陷和检测标准。分别采用二维和三维X射线检测技术对塑封倒装焊器件进行内部缺陷检查,对比分析了这两种检测手段的优缺点,验证了三维X射线检测技术在倒装焊器件缺陷检测中的优势,并给出检测建议。Flip-chip welding devices have the advantages of high interconnection densi ty and good frequency characteristics,which have been rapidly developed and widely used in recent years.The quality of flip bump and BGA solder balls has great influence on the reliability of devices.X ray nondestructive testing technology is an effective means to check the internal defects of device package.Based on the analysis of the basic structure and process of flip-chip welding devices,the common defects and testing standards of flip-chip welding devices are discussed in this paper.Twodimensional and three-dimensional X-ray inspection technology was used to inspect the internal defects of plastic-encapsulated flip-chip welding devices.The advantages and disadvantages of the two methods were compared and analyzed.The advantages of three-dimensional X-ray inspection technology in the defect detection of flip-chip welding devices were verified,and the detection suggestions were given.

关 键 词：X-RAY CT扫描技术 倒装焊 BGA 

分 类 号：TN405[电子电信—微电子学与固体电子学] O434.1[机械工程—光学工程]