多层陶瓷基板电镀层结合力不良的原因和解决措施  

Reasons and solutions for poor adhesion of electroplated coatings on multilayered ceramic substrate

作　　者：周波 唐正生 许海仙 王宁[1,2] ZHOU Bo;TANG Zheng-sheng;XU Hai-xian;WANG Ning(The 43rd Research Institute of China Electronics Technology Group Corporation, Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088 [2]合肥圣达电子科技实业有限公司,安徽合肥230088

出　　处：《电镀与涂饰》2018年第23期1094-1098,共5页Electroplating & Finishing

摘　　要：对多层陶瓷基板结合力不良批次产品的生产过程进行跟踪后发现:因热处理装架时产品的堆叠阻止了腔体中的空气与炉膛中的氮氢混合气氛充分交换,故残留的氧气令首镍层严重氧化,二次镀镍时按标准的前处理酸洗工艺无法有效去除氧化层,导致胶带法结合力测试后镀层起皮。通过调整热处理装架方式及延长二次镀镍前酸洗的时间,该问题得到了解决。Based on the tracking of the production of multilayered metallized ceramic substrates with poor adhesion,it was found that the stacking of products hindered the replacement of the air inside the cavity of the product by the mixed N2–H2gases in the furnace,and the residual oxygen in cavity resulted in the severe oxidation of first nickel layer.The regular pickling treatment prior to the electroplating of second nickel layer was unable to remove the oxide layer effectively,and then the coatings peeled off after a tape adhesion test.Such problem was solved by changing the stacking way of products for heat treatment and extending the pickling time before secondary nickel electroplating.

关 键 词：多层陶瓷基板 腔体 电镀 结合力 起皮缺陷 热处理 酸洗 

分 类 号：TQ153.12[化学工程—电化学工业] TG166.7[金属学及工艺—热处理]