行波管金刚石输能窗片金属化影响因素分析  

Analysis on influence factors of diamond window metallization for traveling wave tube

作　　者：薛辽豫 刘林 张平伟 安晓明 刘青伦[1] XUE Liaoyu;LIU Lin;ZHANG Pingwei;AN Xiaoming;LIU Qinglun(Insititute of Electrics,Chinese Academy of Sciences,Beijing 100190,China;Hebei Institute of Laser,Shijiazhuang 050000,China;Hebei Plasma Diamond Technology Co.,Ltd,Shijiazhuang 050000,China)

机构地区：[1]中国科学院电子学研究所,北京100190 [2]河北省激光研究所,河北石家庄050000 [3]河北普莱斯曼金刚石科技有限公司,河北石家庄050000

出　　处：《电子元件与材料》2019年第1期83-88,共6页Electronic Components And Materials

基　　金：河北省科技计划项目资助(17391111D)

摘　　要：为制备行波管用金刚石输能窗片,分析金刚石金属化影响因素。采用粗糙度、拉曼光谱评估金刚石材料性能。采用酸洗、离子束刻蚀清洗金刚石表面。采用冲压掩膜、光刻掩膜防护非金属化区域。通过物理气相沉积制备Ti/Mo/Ni金属化层,并通过真空热处理方法制备TiC过渡层。结果表明:当金刚石内石墨的质量分数低于1%时,离子束刻蚀方法一方面去除金刚石表面杂质,另一方面将表面粗糙度从0. 256μm提升至0. 343μm;相比冲压掩模,光刻掩模降低界面孔隙率,减少了金属离子对掩模底层的污染,过渡区域宽度从200μm减少至10μm; 700℃保温过程促进了TiC的形成,提升了金属化层结合强度,促进了抗热冲击性能。To prepare the diamond window of the traveling wave tube(TWT),a study on the influence factors of the diamond metallization was researched.The roughness measurement and the Raman spectrum were used to evaluate the properties of diamond material.The acid pickling and the ion beam etching were used to clean the diamond surface.The non metallized area was protected by the stamping mask and the photolithography mask.The Ti/Mo/Ni metal layer was prepared by the physical vapor deposition,and then deal with the heat treatment to obtain the TiC transition layer.The results show that the ion beam etching method can remove the impurity from the diamond surface and improve the surface roughness from 0.256μm to 0.343μm when the mass fraction of graphite within the diamond is lower than 1%.Compared with the stamped mask,the photolithography mask reduces the interface porosity and the pollution of metal ions on the bottom of the mask,and makes the width of the transition region reduce from 200μm to 10μm.The process of heat preservation at 700℃promotes the formation of TiC,and enhances the bonding strength of the metallized layer,and promotes the resistance to thermal shock.

关 键 词：金刚石 金属化 物理气相沉积 掩膜 热处理 碳化钛 

分 类 号：TN124[电子电信—物理电子学]