陶瓷基印制电路板的关键技术研究  

Research on the key technology of ceramic substrate PCB

作　　者：刘华珠 孟昭光 雷秋丽 张项宾 Liu Huazhu;Meng Shaoguang;Lei Qiuli;Zhang Xiangbin

机构地区：[1]东莞理工学院电子工程与智能化学院,广东东莞523808 [2]东莞市五株电子科技有限公司,广东东莞523293

出　　处：《印制电路信息》2019年第2期30-33,共4页Printed Circuit Information

基　　金：广东科技计划项目2016B090918008;2016B090920002

摘　　要：陶瓷基印制电路板具有高频性能好、热导率高、化学性能稳定等特点,应用于高发热等大功率电子组件中。本文针对陶瓷基印制电路板的相关关键技术进行研究,主要包括陶瓷基片的制备、烧结工艺、金属化工艺与金属敷接工艺,为陶瓷基印制电路板相关新技术的开发提供良好的技术支持。Ceramic substrate Printed Circuit Board (PCB) has excellent high frequency performance, high thermal conductivity, stable chemical properties, and is widely used in the high thermal and other high power electronic components. This paper studies on key technology for ceramic substrate PCB, including the preparation and sintering process of ceramic substrate, metal welding process and metal deposition, to provide good technical support to develop new technology for ceramic substrate PCB.

关 键 词：陶瓷基板 电路板 烧结工艺 金属化 

分 类 号：TN41[电子电信—微电子学与固体电子学]