SOP8分层探究及解决  

SOP 8 Delamination Exploration and Solution

作　　者：李进 朱浩 LI Jin;ZHU Hao(Eternal Electronic Materials Co., Ltd., Kunshan 215301, China)

机构地区：[1]长兴电子材料有限公司,江苏昆山215301

出　　处：《电子与封装》2019年第4期10-14,18,共6页Electronics & Packaging

摘　　要：塑料封装作为一种非气密性封装,分层一直是制约其可靠性的一个关键因素,也是可靠性需解决的难点之一。选择确立较为稳定、成熟的引线框架塑料封装制程,研发一款抗分层表现良好的SOP8,搭配优选过的环氧模塑料(EMC),使塑料封装的可靠性大大提升,也促进了EMC在塑料封装中的应用和表现。As a kind of non-airtight package, delamination has always been a key factor restricting its reliability and one of the difficulties to be solved. Choose to establish a stable and mature plastic packaging process of lead frame, develop a SOP8 with good performance of anti-delamination, and match optimal EMC, so that the reliability of plastic packaging is greatly improved, and is bound to boost EMC packaging in the plastic packaging has a better performance.

关 键 词：塑料封装 分层 可靠性 

分 类 号：TN305.94[电子电信—物理电子学]