宇航用BGA器件装联工艺可靠性问题探讨  

A study on reliability of assembly process for aerospace BGA components

作　　者：李培蕾 朱恒静[1] 王智彬[1] 孟猛 Li Peilei;Zhu Hengjing;Wang Zhibin;Meng Meng(China Aerospace Components Engineering Center, Beijing 100094, China)

机构地区：[1]中国航天宇航元器件工程中心,北京100094

出　　处：《质量与可靠性》2019年第2期34-38,共5页Quality and Reliability

摘　　要：提出了一种宇航用球栅阵列(Ball Grid Array, BGA)器件可靠性评价方法。通过分析宇航用BGA器件的失效案例,梳理器件结构和组成材料的典型特性,得到其失效模式和失效机理。据此开展有限元仿真,并依据模型预测疲劳寿命,同时提出装联工艺质量检测试验项目并制定分级试验方案,给出了量化判据的确定准则,从而建立了一种宇航用BGA器件装联工艺可靠性评价方法。A reliability evaluation method of(Ball Grid Array, BGA) components for the aerospace application is presented in this paper. The failure modes and failure mechanisms of BGA components are obtained by analyzing the failure cases and combining with the typical characteristics of the components and materials. Then on the basis of this, the finite element simulation is carried out and the fatigue life is predicted according to relative models. At the same time, the reliability evaluation test items of the assembly process are raised and the graded experimental scheme is formulated. The rules to form quantitative criteria for reliability grading evaluation are put forward in the end.

关 键 词：失效物理 BGA 装联工艺可靠性 分级评价 

分 类 号：V465[航空宇航科学与技术—航空宇航制造工程]