磁控共溅射法在聚碳酸酯柔性基底镀TiN研究  

Deposition of TiN Films on Flexible PC Substrate by Magnetron Co-Sputtering

作　　者：邓爱民[1] 梁佳静 张国家 DENG Aimin;LIANG Jiajing;ZHANG Guojia(School of Material Science and Engineering,Shenyang Ligong University,Shenyang 110168,China)

机构地区：[1]沈阳理工大学材料科学与工程学院,辽宁沈阳110159

出　　处：《电镀与精饰》2019年第5期1-3,共3页Plating & Finishing

摘　　要：在较低的温度下,采用磁控溅射工艺在聚碳酸酯(PC)表面制备了TiN薄膜。应用激光共聚焦显微镜(CLSM)和X射线衍射仪(XRD)等研究了薄膜制备工艺对薄膜的表面微观形貌和晶质成分影响。结果表明:随着基底温度的升高,溅射的薄膜厚度和表面粗糙度增大。溅射的薄膜中,晶粒呈圆锥形,随着N_2含量的增加,溅射的薄膜粗糙度逐渐下降,晶粒较小,分布较均匀。XRD衍射结果表明,溅射的薄膜晶质成分为TiN。Titanium nitride(TiN)thin films were deposited on polycarbonate(PC)substrates by magnetron sputtering at low temperature. Surface morphology and the phase structures of the films were investigated by confocal laser scanning microscopy(CLSM),X-ray diffraction(XRD). The results show that the thickness and roughness of the film is increased by the increase of sputtering temperate. The grains deposited present a cone-shaped microstructure. The grain size of TiN and the roughness of the film decreases with increasing the content of the nitrogen. XRD analysis shows that phase TiN films has been formed.

关 键 词：氮化钛薄膜 聚碳酸酯基体 磁控溅射 

分 类 号：TN304[电子电信—物理电子学]