混装氮气回流焊接技术研究  

Research on Nitrogen Reflow Soldering in Mixed Assembly Technology

作　　者：张辉华[1] 黎全英[1] 邴继兵[1] ZHANG Huihua,;LI Quanying;BING Jibing(The 30th Research Institute of CETC, Chengdu 610041, China)

机构地区：[1]中国电子科技集团公司第三十研究所

出　　处：《电子工艺技术》2019年第3期143-147,156,共6页Electronics Process Technology

基　　金：十三五XX联合基金项目(6141B08120302)

摘　　要：在电子产品生产中,有铅器件和无铅器件的混装工艺会长期存在,采用有铅焊料焊接有铅/无铅元器件的混装工艺技术需要不断创新。从试验板设计、温度曲线设计、工艺试验和质量评价等方面研究了氮气在混装回流焊接技术中的应用,氮气的应用可以改善焊料润湿性,降低印制板组件焊接缺陷,提高军用印制板组件焊点可靠性和稳定性。In the production of electronic products, the mixed assembly process of lead and lead-free components will exist for a long time, it is necessary to innovate the mixed assembly technology of lead/lead-free components by using Sn-Pb solder. The application of nitrogen on reflow soldering in mixed assembly technology was studied from the aspects of test board design, temperature curve design, process test and quality evaluation. The application of nitrogen can improve the wettability of solder, reduce the welding defect PCB components, and improve the reliability and stability of solder joints of military PCB components.

关 键 词：氮气 焊点质量 可靠性 回流焊 

分 类 号：TN605[电子电信—电路与系统]