氮化铝封装外壳引脚焊接强度研究  

Study on pin brazing strength of AlN package

作　　者：钟永辉 孙刚[1,2] 王宁 方军[1,2] 崔嵩 ZHONG Yonghui;SUN Gang;WANG Ning;FANG Jun;CUI Song(The 43rd Research Institute of CETC, Heifei 230088, China;Hefei Shengda Electronics Technology Industry Co., Ltd, Heifei 230088, China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088 [2]合肥圣达电子科技实业有限公司,安徽合肥230088

出　　处：《电子元件与材料》2019年第10期63-67,73,共6页Electronic Components And Materials

基　　金：军委装备发展部支撑科研项目(1905WP0005,1807WP0010)

摘　　要：为了契合整机装备及系统级封装的高可靠需求,对氮化铝封装外壳引脚焊接强度进行研究。通过设计有引脚氮化铝陶瓷封装模型,采用拉力试验机对钎焊后的金属引脚进行垂直拉力和90°剥离力试验,研究了镀镍层厚度、钎料量、钎焊结构对金属引脚与陶瓷银铜共晶钎焊结合力的影响。结果表明:随着陶瓷镀镍层厚度及钎料量的增加,钎焊后的结合力有下降的趋势;不同的钎焊结构导致金属引脚受力失效模式不同,采用引脚打弯的焊接结构可有效提高金属引脚的焊接强度,满足工程化应用需求。In order to meet the high reliability requirements of the equipment and SIP, the brazing strength of the pin in AlN package was studied.By designing the AlN ceramic with lead package model, the tensile test and the 90° peel force test were carried out on the brazed lead by tensile testing machine.The influence of the nickel plating thickness, the amount of solder and the brazing structure on the strength of metal pin and ceramic silver-copper eutectic brazing were studied.The results show that with the increase of the nickel plating thickness and the amount of solder, the strength after brazing tends to decrease.Different brazing structures lead to different stress failure modes of metal pins.The brazing structure with pin bending can effectively improve the brazing strength of metal pins and meet the needs of engineering applications.

关 键 词：氮化铝 封装外壳 钎焊 金属引脚 强度 

分 类 号：TN405[电子电信—微电子学与固体电子学]