适用于3D裸芯片叠层塑封器件的DPA试验方法研究  

Research on the DPA Test Method for 3D Bare Chip Laminated Plastic Packaging Device

作　　者：王斌[1] 江凯 周帅[1] 王小强[1] WANG Bin;JIANG Kai;ZHOU Shuai;WANG Xiaoqiang(CEPREl, Guangzhou 510610, China)

机构地区：[1]工业和信息化部电子第五研究所

出　　处：《电子产品可靠性与环境试验》2019年第5期49-54,共6页Electronic Product Reliability and Environmental Testing

摘　　要：由于3D叠层塑封器件的封装类型的特殊性和复杂性,传统的破坏性物理分析试验方法无法满足对该类型器件的芯片开裂、分层和键合失效(开路或短路)等失效模式的完整考核。因此,结合3D叠层塑封器件独特的结构和工艺,针对3D裸芯片叠层塑封器件的典型失效模式,研究了2D与3D相结合的X射线检查方法、C扫描/B扫描/透射模式相结合的声学扫描显微镜检查方法和基于芯片减层和分离技术的内部目检方法等新型DPA试验方法,并为3D叠层塑封器件的样品开封和层间分离等提供了指导性意见,满足了对3D叠层封装器件的设计、结构、材料、制造质量和工艺情况等进行完整考核的需要。Due to the particularity and complexity of the packaging type of 3D laminated plastic packaging devices, the traditional DPA test methods can not satisfy the complete examination of the failure modes of the devices, such as chip craking, delamination, bonding failure ( open circuit or short circuit) and so on. Combined with the unique structure and process of 3D laminated plastic packaging device, the new DPA test methods, such as the X-ray inspection method combining 2D and 3D, acoustic scanning microscope method combining with C-scan, B- scan and transmission mode, and the internal visual inspection method based on chip delamination and separation technology, are studied aiming at the typical failure modes of 3D bare chip laminated plastic devices, and the guidance for sample unsealing and interlayer separation of 3D laminated plastic devices are provided, which meets the need for the complete assessment of the design, structure, materials, manufacturing quality and process conditions of 3D laminated packaging devices.

关 键 词：3D叠层塑封器件 破坏性物理分析 X射线检查 声学扫描显微镜检查 内部目检 

分 类 号：TB114.3[理学—概率论与数理统计]