铜CMP中SiO_2抛光液的凝胶及其消除实验  

Gelatin of SiO_2 slurry and its elimination in Cu CMP

作　　者：王新[1] 刘玉岭[1] 康志龙[1] 

机构地区：[1]河北工业大学,天津300130

出　　处：《半导体技术》2003年第1期63-65,共3页Semiconductor Technology

基　　金：国家自然科学基金资助项目(60176033);河北省自然科学基金资助项目(502029)

摘　　要：SiO2在不同的pH值抛光液中容易产生凝胶现象而使抛光液失效。通过控制实验时抛光液的pH值及加入适量的添加剂而使SiO2抛光液的凝胶问题得到解决。结果表明,当SiO2抛光液pH≤8时,产生凝胶;当SiO2抛光液pH≥9时,在抛光液中加入适量的活性剂和螯合剂,消除了SiO2凝胶现象,得到较好的抛光结果。SiO2 is gelled easier in slurry of different pH value, so that slurry is abated. In theexperiment, the pH value of the slurry which contained a limited additive is controlled, the problem ofthe SiO2 gelatin is resolved. It shows that colloidal silica is gelled when pH of the slurry equals to orlower than 8, and when it equals to or higher than 9, as well as a limited surfactant and chelating wereadded into the slurry, the gelatin of SiO2 was eliminated. The experiment shows that the result of CuCMP is better by using the slurry.

关 键 词：抛光液 凝胶 消除实验 铜CMP SIO2 二氧化硅 

分 类 号：TN305.2[电子电信—物理电子学]