铝硅丝超声键合引线失效分析与解决  

Lead Failure Analysis and Solution of Al-Si Wire Ultrasonic Bonding

作　　者：刘笛[1] LIU Di(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)

机构地区：[1]中国电子科技集团公司第四十七研究所

出　　处：《微处理机》2019年第4期5-8,共4页Microprocessors

摘　　要：在微电子封装中,引线键合是实现封装体内部芯片与芯片及芯片与外部管脚间电气连接、确保信号输入输出的重要方式,键合的质量直接关系到微电子器件的质量和寿命。针对电路实际生产中遇到的测试短路、内部键合丝脱落等问题,分析其失效原因,通过试验,确认键合点间距是弧形状态的重要影响因素。据此,基于键合设备的能力特点,在芯片设计符合键合工艺规则的前提下,提出键合工艺的优化。深入探讨在设计芯片和制定封装工艺方案时,保证键合点与周围金属化区域的合理间距以及考虑芯片PAD与管壳键合指的距离的重要性。In view of the problems encountered in the actual production of the circuit,such as test short circuit and internal bonding wire falling off,the failure causes are analyzed,Through the test,it is confirmed that the bonding point spacing is an important influencing factor for the loop shape.According to this,based on the capability characteristics of bonding equipment,the optimization of bonding process is proposed on the premise that the chip design conforms to the bonding process rules.The importance of ensuring a reasonable distance between the bonding points and the surrounding metallization areas and considering the distance between the chip PAD and the package bonding fingers when designing the chip and making the package process plan is deeply discussed.

关 键 词：封装 引线失效 键合 键合点间距 弧形 

分 类 号：TN305.96[电子电信—物理电子学]