高密集金属微通道散热器成形及封装工艺研究  

Research on Forming Process and Packaging Technology of High Density Metal Microchannel Heat-Sink

作　　者：赵雯 吕辉 翟科 宋满仓[1] 魏壮壮 姬学超 杜立群[1] ZHAO Wen;LüHui;ZHAI Ke;SONG Mancang;WEI Zhuangzhuang;JI Xuechao;DU Liqun(Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;The 14th Research Institute of China Electronics Technology Group Corporation,Nanjing 210039,China)

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]中国电子科技集团公司第十四研究所,南京210039

出　　处：《航空制造技术》2019年第19期92-98,共7页Aeronautical Manufacturing Technology

基　　金：国家自然科学基金项目(51375077,51475245);大连理工大学创新团队项目(DUT16TD20)

摘　　要：对高密集金属微通道散热器的成形及封装工艺进行了研究。基于UV LIGA技术制作了通道宽度为100μm、高度大于500μm的高密集金属微通道底板,并将微通道底板与盖板进行封装。针对高密集金属微通道散热器封装中存在的封装面无法完全贴合的问题,提出了一种基于过渡层补偿的封装方法。为了满足封装气密性及强度的要求,制作了标准试样,进行了剪切试验,对比了银浆、环氧树脂和金属锡浆3种过渡层材料的剪切强度。结果表明金属锡浆的剪切强度最大,并进一步探究了封装面的表面粗糙度对结合强度的影响。基于上述工艺制作出了金属微通道散热器,经2MPa水压密封性检测无泄漏,满足使用要求。The processing technology of high density metal microchannel heat-sink was studied.Based on UV-LIGA technology,the high density mental microchannel plate with 100μm in width and over 500μm in height was fabricated.Then the microchannel plate and the cover plate were packaged.Aimed at the problem that the sealing surface of the high density mental microchannel heat-sink can not be completely bonded when packaging,a novel method based on transition layer compensation was proposed.In order to meet the requirements of air tightness,a shear experiment was carried out in which the shear strength of silver paste,epoxy resin and solder paste were compared.The result shows that the solder paste has the largest shear strength and effect of surface roughness on the bonding strength was further explored.A metal microchannel heat-sink was fabricated based on above technologies.There is no leakage in 2MPa hydraulic seal test,which satisfies the design requirement.

关 键 词：散热器 微通道 封装 UV-LIGA 密封性 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]