浅析微组装技术  

Brief Analysis of Microassembly Technology

作　　者：王圣涛 关晓丹[1] WANG Sheng-tao;GUAN Xiao-dan(North China Institute of Aerospace Engineering,Langfang,Hebei 065000)

机构地区：[1]北华航天工业学院

出　　处：《电子元器件与信息技术》2019年第8期104-107,共4页Electronic Component and Information Technology

摘　　要：这些年来电子技术持续发展,电子产品的组装技术伴随时代潮流在技术上进行着变革和创新,从一开始的手工操作发展到如今的微组装时代。正是由于微组装时代的降临,使得电子产品开始走向了便携化、小型化、牢固化的趋势。本文主要是对微组装技术的相关概念、发展现状与主要内容、未来的发展趋势等方面进行简要的介绍。With the continuous development of electronic technology in these years,the assembly technology of electronic products is changing and innovating in technology with the trend of The Times,from the manual operation at the beginning to the present micro-assembly era.It is the advent of the era of micro-assembly that makes electronic products begin to move towards the trend of portability,miniaturization and firmness.This paper mainly introduces the related concepts,development status and main contents of microassembly technology,and the development trend in the future.

关 键 词：典型产品结构 LTCC 无源元件 无铅化 

分 类 号：TN405[电子电信—微电子学与固体电子学]