基于SiP封装技术的氮化铝多层陶瓷管壳的研制  

Research on Aluminum Nitride Multilayer Ceramic Package of SiP Technology

作　　者：王宁[1] 刘全威[1] 张崎[1] 张志成[1] 余桂舟 周波 WANGNing;LIU Quan-wei;ZHANG Qi;ZHANG Zhi-cheng;YU Gui-zhou;ZHOU Bo(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088

出　　处：《混合微电子技术》2018年第3期75-79,共5页Hybrid Microelectronics Technology

摘　　要：SiP(System in Package)系统级封装技术具有小型化、高性能、多功能、高可靠和低成本的特点,基于SiP系统级封装的特点,本文设计并研制了一款高性能星用氮化铝多层陶瓷管壳,体积缩小为原来的1/3。通过对陶瓷管壳的结构和热进行应力仿真,并对氮化铝多层陶瓷和焊接的工艺进行研究,最后对产品进行可靠性性能测试,各项指标均满足星用陶瓷管壳的要求。SiP(System in Package)has the characteristics of miniaturization,high performance,multi-function,high reliability and low cost.As the characteristics of SiP,this paper designs and develops one highly reliable Aluminum nitride multilayer ceramic package for satellite,and its volume is reduced by 1/3.By simulating the structure and heat of the package,and studying the technology of aluminum nitride multilayer and welding,all indicators meet the requirements of satellite ceramic package while testing the reliability performance.

关 键 词：SIP 氮化铝 多层陶瓷 陶瓷管壳 焊接 

分 类 号：TM286[一般工业技术—材料科学与工程]