微波复合介质板的介电性能验证研究  

Research on Verification of Dielectric Properties for New Microwave Laminates

作　　者：赵丹[1] 邹嘉佳[1] 方南军 ZHAO Dan;ZOU Jiajia;FANG Nanjun(China Electronics Technology Group Corporation No3%Research Institute,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所

出　　处：《电子与封装》2020年第1期1-4,共4页Electronics & Packaging

摘　　要：以国外某公司的微波复合介质基板测试数据为参考,采用50Ω阻抗匹配电路测试了介电常数为2.94的某国产微波复合介质板在10 GHz下的驻波、插入损耗。测试结果表明,国产微波复合介质板的介电性能满足电路使用要求。高低温环境下的性能测试结果表明国内板材的一致性略逊于国外产品,仍需对制备工艺的稳定性、一致性进行改善优化。Using the test data of a foreign company’s microwave composite dielectric board as a reference, the standing wave and insertion loss of a domestic microwave composite dielectric board with dielectric constant of 2.94 at 10 GHz are measured by means of a 50 Ω impedance-matching circuit. The test results show that the dielectric properties of the domestic microwave composite dielectric board meet the circuit requirements. Through the performance test in high/low temperature environments, the results show that the consistency of domestic plate is slightly lower than those of foreign products, and the stability and consistency of the preparation process still need to be improved and optimized.

关 键 词：微波复合介质板 介电性能验证 基本电路 一致性 

分 类 号：TM215.1[一般工业技术—材料科学与工程] TN405.97[电气工程—电工理论与新技术]