一种小型高集成度SiP模块设计  

Design of a Small High Integration SiP Module

作　　者：楚要钦[1] 张国强 施辰光 刘永强[1] CHU Yao-qin;ZHANG Guo-qiang;SHI Chen-guang;LIU Yong-qiang(Xi'an Aeronautics Computing Technique Research Institute,AVIC,Xi'an 710068,China;Aviation Military Representative Bureau,Army Equipment Department,Xi'an 710068,China)

机构地区：[1]航空工业西安航空计算技术研究所,陕西西安710068 [2]陆军装备部航空军代局驻西安地区航空军代室,陕西西安710065

出　　处：《航空计算技术》2020年第1期84-87,共4页Aeronautical Computing Technique

基　　金：航空科学基金项目资助(2015ZC31005)。

摘　　要：小型化是未来嵌入式计算机发展的核心需求,SiP(System in Package)技术作为实现电子系统小型化的关键技术手段,已在工业领域中大量使用,但受限于可靠性和KGD(Know Good Die)技术,在航空领域中的应用仍较为缓慢。分析了嵌入式计算机小型化的技术需求,结合SiP技术特点确定了小型化SiP模块研发技术路线,通过优化SiP模块系统架构,采用全国产化裸芯实现了小型化、可配置的SiP模块,提高了嵌入式计算机的集成度和可靠性。经地面环境仿真验证,能够满足嵌入式计算机的研制要求,适用于小型化航空电子系统。Miniaturization is the core requirement of the development of embedded computer in the future.SiP(System in Package)technology,as a key technology means to realize miniaturization of electronic system,has been widely used in the industrial field,but limited by reliability and KGD(Know Good Die)technology,its application in the aviation field is still relatively slow.This paper analyzes the technical requirements of miniaturization of embedded computer,and determines the technical route of miniaturization of SiP module research and development based on the characteristics of SiP technology.By optimizing the system architecture of SiP module,the miniaturization and configurable SiP module is realized by adopting the national produced dies,which improves the integration and reliability of embedded computer.Through the simulation of ground environment,it can meet the development requirements of embedded computer and is suitable for miniaturized avionics system.

关 键 词：嵌入式计算机 SIP 处理器模块 实时操作系统 

分 类 号：TP338[自动化与计算机技术—计算机系统结构]