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作 者:魏壮壮 高林松 王仁彻[3] 吕辉 杜立群[1] WEI Zhuangzhuang;GAO Linsong;WANG Renche;LV Hui;DU Liqun(Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;School of Energy and Power Engineering,Dalian University of Technology,Dalian 116024,China;The 14th Research Institute of China Electronics Technology Group Corporation,Nanjing 210039,China)
机构地区:[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]大连理工大学能源与动力工程学院,大连116024 [3]中国电子科技集团公司第十四研究所,南京210039
出 处:《真空与低温》2020年第2期131-138,共8页Vacuum and Cryogenics
基 金:国家自然科学基金(51975103)。
摘 要:为了解决雷达等高热流密度电子设备的散热问题,通过数值模拟方法,设计了一款高宽比为5,当量直径为166.67μm的金属微通道热沉。基于热边界层中断技术,设计出间断的微通道,提升了热沉的换热性能。利用SU-8胶紫外光刻和微电铸技术制作了微通道热沉底板,再将盖板与底板焊接在一起得到金属微通道热沉。搭建了换热性能测试系统,以去离子水为工质,对微通道热沉进行了实验研究。实验结果表明,当热沉底部热源的热流密度为74.5 W/cm2、工质流量为1.8 L/min时,其底部温度低于40℃,平均换热系数达到67.0 kW/(m2·K)。In order to save the heat of radar and other electronic equipment with high heat flux,a metal microchannel heat-sink with the aspect ratio of 5 and the hydraulic diameter of 166.67μm was designed by numerical simulation.Based on the breaking-up thermal boundary layer technology,the heat transfer performance of heat-sink was improved by interrupted microchannel.The microchannel baseplate was fabricated by UV lithography of SU-8 photoresist and micro electroforming technology.The metal microchannel heat-sink was obtained by welding the cover plate to the microchannel baseplate.A testing system for heat transfer performance was established.The microchannel heat-sink was experimentally investigated with deionized water as working medium.The experimental results indicate that the temperature at the bottom of heat-sink is lower than 40℃when the heat flux of heat source is 74.5 W/cm2 and the flow rate of working medium is 1.8 L/min,and the average heat transfer coefficient of metal microchannel heat-sink reached 67.0 kW/(m2·K).
关 键 词:微通道热沉 UV-LIGA 换热性能 热边界层中断
分 类 号:TK124[动力工程及工程热物理—工程热物理]
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