提升LED芯片产能的划片技术研究  

Research on Dicing Technology to Improve LED Chip Productivity

作　　者：郑佳晶[1] 高爱梅[1] ZHENG Jiajing;GAO Aimei(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2020年第2期39-42,61,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了几种不同切割技术在蓝宝石衬底发光二极管芯片切割中的应用情况,对比和分析了不同切割技术的优缺点。隐形切割技术由于具有切割效率高、切痕小,切割面损伤小等优点,解决了芯片加工效率低的问题,并提高了芯片的亮度和可靠性。阐述了隐形切割技术对提高LED芯片产能的贡献。The application of several different cutting techniques in sapphire substrate LED chip cutting is introduced in this paper.The advantages and disadvantages of different cutting techniques are compared and analyzed.The stealth dicing technology has the advantages of high cutting efficiency,small cutting path and small damage.The problem of low efficiency of chip processing has been solved,improving the brightness and reliability of the chip.The contribution of stealth cutting technology to improving the capacity of LED is described in detail.

关 键 词：激光切割技术 隐形切割 蓝宝石衬底 

分 类 号：TN405[电子电信—微电子学与固体电子学]