无铅锡膏中助焊剂对LED的影响  

The Effect of Flux on LED in Lead-Free Solder Paste

作　　者：周鹏 杨璐 唐潇婷 陈运发 ZHOU Peng;YANG Lu;TANG Xiaoting;CHEN Yunfa(Foshan NationStar Optoelectronics Co.,Ltd.,Foshan 528000,China)

机构地区：[1]佛山市国星光电股份有限公司,广东佛山528000

出　　处：《中国照明电器》2020年第3期21-25,共5页China Light & Lighting

摘　　要：LED因为其器件结构和材料特性极易被化学物质污染导致光衰、失效,如溴污染,而溴化类物质往往被作为活性剂添加在无铅焊膏助焊剂中,添加含量完全符合RoHS法规。通过扫描电子显微镜-能谱仪(SEM-EDS)和重现实验,对这类锡膏应用在LED灯具组装过程中对于LED的影响进行了案例分析,对溴化污染入侵LED途径和反应原理进行了剖析,最后对规避LED溴化提出了使用建议。LED due to its device structure and material characteristics is easily contaminated by chemical materials,such as bromine pollution,resulting in light decay and failure.But the brominated substances are often added as surfactants in lead-free solder paste flux,and its content is in full compliance with RoHS regulations.By SEM-EDS and experiment,this paper makes a study of the influence of the solder paste on LED of the process of LED lamp assembly,analyzes the invasive route and reaction principle of bromination pollution,and finally puts forward some suggestions for avoiding LED bromination.

关 键 词：LED 无铅锡膏 助焊剂 ROHS 溴污染 

分 类 号：TN383[电子电信—物理电子学]