助焊剂成分及无铅焊膏的研究进展  

Research Progress of Flux Composition and Lead-free Solder Paste

作　　者：穆荻 刘旭东[1] 孙旭东 MU Di;LIU Xu-dong;SUN Xu-dong(College of Environmental and Chemical Engineering,Dalian University,Dalian 116622,Liaoning Province)

机构地区：[1]大连大学环境与化学工程学院,辽宁大连116622

出　　处：《沈阳工程学院学报（自然科学版）》2020年第2期86-91,共6页Journal of Shenyang Institute of Engineering:Natural Science

基　　金：云南省科技厅重大科技项目(No.2018ZE-001)。

摘　　要：根据不同的助焊剂性能特点,总结了溶剂、活性剂、触变剂、抗氧化剂等在助焊剂成分中的研究进展,对无铅焊膏逐渐取代含铅焊膏的现状进行了分析,同时探究助焊剂的成分配比和铺展性能,提出合理的成分方案,并对助焊剂的发展前景进行了展望。According to the different flux characteristics, the research development of the solvent, surfactant,thixotropic agent, antioxidant and etc. in flux composition was summarized, and the status quo of lead-free solder paste instead of leaded solder paste gradually replaced was analyzed. And then, a reasonable composition scheme was put forward by exploring the flux ratio of ingredients, spreading performance, and the development prospect of flux was discussed.

关 键 词：无铅焊膏 助焊剂 铺展性能 

分 类 号：TQ15[化学工程—电化学工业]