聚酰亚胺塑料表面激光诱导活化化学镀铜  

Laser-Indcced Activation Electroless Copper Plating on Surfcce of Polyimide Plastics

作　　者：王攀 崔开放 钟良[1] WANG Pan;CUI Kaifang;ZHONG Liang(School of Manufacturing Science and Engineering,Southwest University of Science and Technology,Mianyang 621000,China)

机构地区：[1]西南科技大学制造科学与工程学院,四川绵阳621000

出　　处：《电镀与环保》2020年第3期30-33,共4页Electroplating & Pollution Control

基　　金：西南科技大学研究生创新基金资助(18ycx107)。

摘　　要：以硫酸铜和次磷酸钠为主要成分配制活化液,并将其均匀涂在改性后的聚酰亚胺基体表面。通过激光诱导使基体活化,施镀后得到平整、致密的化学镀铜层。研究了不同改性工艺对激光诱导活化化学镀铜效果的影响。采用接触角测量仪分析了不同改性工艺条件下基体的亲水性,并通过扫描电镜观察改性前后和激光诱导活化前后基体的表面形貌。结果表明:飞秒激光刻蚀改性后的基体具有良好的亲水性,其表面形成的刻蚀孔洞为激光诱导活化后生成的铜微粒提供了吸附场所,施镀后得到结合力良好的化学镀铜层。The activation liquid was prepared by using copper sulfate and sodium hypophosphite as main components,and it was uniformly applied to the surface of the modified polyimide substrate.The substrate was activated by laser induction,and a flat and dense electroless copper coating was obtained after electroless plating.The effects of different modification processes on the laser-induced activation electroless copper plating were studied.The hydrophilicity of the substrate under different modification conditions was analyzed by contact angle measuring instrument,and the surface morphology of the substrate before and after modification and before and after laser-induced activation were observed by scanning electron microscopy.The results showed that the substrate has good hydrophilicity after femtosecond laser etching,and the etched holes formed on the surface provide the adsorption site for the copper particles generated by laser-induced activation.After electroless plating,the electroless copper coating with good bonding force was obtained.

关 键 词：聚酰亚胺塑料 激光 无钯活化 化学镀铜 

分 类 号：TQ153[化学工程—电化学工业]