现代元器件尺寸测量方法  

Measurement of Dimension Methods for Electronic Components

作　　者：罗宏伟[1] 周帅[1] 马凌志 项舰 罗捷 LUO Hongwei;ZHOU Shuai;MA Lingzhi;XIANG Jian;LUO Jie(CEPREI,Guangzhou 510610,China)

机构地区：[1]工业和信息化部电子第五研究所,广州510610

出　　处：《电子与封装》2020年第6期1-7,共7页Electronics & Packaging

基　　金：国家重点研发计划No.2017YFB0503200(芯片原子钟技术);广州市科学研究计划No.201904010457(面向5G通信的GaN HEMT热特性检测及寿命预测研究)。

摘　　要：尺寸测量是评估元器件的结构是否满足设计要求及安装匹配性的重要手段。介绍了现代元器件尺寸测量的主要方法及测量原理,包括接触式三坐标测量、激光三角测量及激光共聚焦测量等新技术。针对现代元器件测量难点,对不同测量方法的适用范围及局限性进行了论述,并总结了现代元器件尺寸测量仍需要解决的一些典型问题。The measurement of dimension is a crucial tool to evaluate the structure and the matching with PCB.The main methods and measuring principles of electronic components measurementare presented here,including contact three coordinate measuring system,laser triangulation measuring system and laser confocal measuring system.With the measurement difficulties of electronic components,the application and limitations of different measurement methods are discussedandsome typical problems in electronic component measurement are summarized.

关 键 词：尺寸测量 电子元器件 接触式测量 非接触式测量 

分 类 号：TN307[电子电信—物理电子学]