一种微机电封装中粘接层间剥离应力计算方法  

A Method for Calculating Interfacial Stress of Adhesive Layer in Micro-Electromechanical Packaging

作　　者：封宝柱 戴强[1] 罗钧文 FENG Bao-zhu;DAI Qiang;LUO Jun-wen(Manufacturing Process Testing Technology-Provincial Key Laboratory of Ministry of Education,School of Manufacturing Science and Engineering,Southwest University of Science and Technology,Sichuan Mianyang 621000,China)

机构地区：[1]西南科技大学制造科学与工程学院制造过程测试技术—省部共建教育部重点实验室,四川绵阳621000

出　　处：《机械设计与制造》2020年第6期130-133,共4页Machinery Design & Manufacture

基　　金：制造过程测试技术—省部共建教育部重点实验室开放项目,MEMS传感器与微纳米器件的失效分析研究(13zxzk08)。

摘　　要：基于弹性力学理论和经典Sujan方法,研究了微机电系统封装中芯片与基板之间粘接层在受到均匀温度载荷时的剥离应力,提出了一种新的计算方法.该方法通过弯矩与曲率的关系,求出曲率方程,进而经由挠度求得剥离应力.经过与Sujan方法和有限元仿真结果比较,显示新的方法能够很好地体现出了剥离应力的变化趋势和在封装结构末端应力集中处的最大剥离应力且新方法与有限元仿真的差值比Sujan方法减小约13%.该方法可为计算封装结构剥离应力提供参考.Based on the elasticity theory and classical Sujan method,a novel calculation approach is proposed to describe the peeling stress in the adhesive layer in the microelectromechanical system package when the envirment temperature uniform changes,In the approach,the peeling stress is obtained by the relationship between moment,curvature and deflection.Compared with the Sujan method,the new approach can exhibit the trend of peeling stress and the maximum peel stress at free edges better,and the difference is decreased to about 13%.The new approach is helpful in calculating the peeling stress in the package.

关 键 词：微机电系统 粘接层 剥离应力 有限元仿真 

分 类 号：TH16[机械工程—机械制造及自动化] TB305.94[一般工业技术—材料科学与工程]