研磨液悬浮性对SiC晶片加工质量影响的研究  

Study on the Influence of Suspension of Grinding Fluid on the Processing Quality of SiC Wafer

作　　者：张海磊[1] ZHANG Hailei(The 46th Research Institute of CETC,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工业专用设备》2020年第3期16-17,65,共3页Equipment for Electronic Products Manufacturing

摘　　要：介绍了碳化硅晶片双面研磨过程中研磨液悬浮性对晶片去除速率的影响;通过在研磨液中加入不同质量百分比的悬浮剂进行碳化硅双面研磨的对比试验,确定了在研磨液中加入适当比例的悬浮剂能有效地加快晶片去除速率,对研磨生产工艺具有现实的指导意义。This paper introduces the influence of suspension of grinding fluid on removal rate of silicon carbide wafer during double-sided lapping.Through the contrast experiment of Silicon Carbide double-sided grinding by adding different mass percentage of suspending agent in the grinding solution,it is determined that adding proper proportion of suspending agent in the grinding solution can effectively speed up the chip removal rate,it has practical significance for grinding production process.

关 键 词：SiC晶片 双面研磨 悬浮剂 磨料 

分 类 号：TN305.2[电子电信—物理电子学]