电路基板切割工艺设备故障预测技术  

Fault Prediction Technology of Cutting Equipment for Circuit Substrates

作　　者：蔡克新 张彩云 CAI Kexing;ZHANG Caiyun(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2020年第3期134-137,共4页Electronics Process Technology

基　　金：基础科研项目(JCKY2018210B005)。

摘　　要：随着电路基板切割工艺设备技术难度和复杂度不断增强,其在运行过程中易出现性能状态的退化,甚至发生故障。故障预测技术可提高设备运行过程中的可靠性和安全性。分析了电路基板切割工艺设备故障预测方法,重点论述了设备故障模式预测、状态趋势预测、剩余寿命预测和设备维修策略优化等内容,为实现电路基板切割设备的高可靠运行和低成本维护提供技术保障。With the increasing technical diffi culty and complexity of the cutting-processing equipment for circuit substrates,performance degradation occurs easily during equipment operation,and the equipment even breaks down.Fault prediction technology can improve the reliability and safety of the equipment during operation.The fault prediction mode of cutting equipment is analyzed,the research contents are mainly discussed in equipment failure mode prediction,state trend prediction,residual life prediction and equipment maintenance strategy optimization,which provides technical support for the high reliable operation and lowcost maintenance of the cutting equipment.

关 键 词：电路基板 切割工艺 故障预测 维修决策 

分 类 号：TN6[电子电信—电路与系统]