雷达高频T/R组件的多层电路基板制造技术  

Manufacturing Process of High Frequency Multilayer Circuit Substrate for Radar Microwave Modules

作　　者：戴敏[1] 张伟[1] 沈克剑 李浩[1] DAI Min;ZHANG Wei;SHEN Kejian;LI Hao(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子工艺技术》2020年第4期187-189,221,共4页Electronics Process Technology

摘　　要：介绍了雷达微波组件高频多层电路制造技术,重点阐述了传统陶瓷基多层电路及TSV多层电路两种工艺。传统陶瓷基高频多层电路主要包括纯陶瓷基材薄膜多层基板、LTCC(低温共烧陶瓷)、HTCC(高温共烧陶瓷)等类型。通过溅射、光刻和电镀等薄膜工艺或者冲孔、印刷和烧结等厚膜工艺,陶瓷基多层电路将无源器件和传输线等高密度集成,应用于先进的微波组件。TSV多层电路则能够用于实现超高集成度的三维片式组件。通过多层电路基板制造工艺的探讨,可为雷达微波组件的研制和生产提供一定的借鉴。The manufacturing process of high frequency multilayer circuit substrate used in radar microwave modules is introduced.The process of traditional ceramics-based multilayer substrate and TSV-based multilayer substrate is discussed in detail.The traditional ceramics-based multilayer substrates mainly include pure ceramic substrate,low temperature co-fired ceramics and high temperature co-fired ceramics.High density integration of passive devices and transmission lines in ceramics-based multilayer substrates,which widely used in radar microwave module,can be realized by sputtering,photolithography and electroplating process or drilling holes,printing and sintering process.TSV-based multilayer substrate can be used in ultra-high density integration 3D tile module.The discussion on the manufacturing process of high frequency multilayer circuit can provide a reference for the development of microwave modules.

关 键 词：高频多层电路 HTCC LTCC TSV 

分 类 号：TN405[电子电信—微电子学与固体电子学]