芯片封装工艺的改进方法研究  

Study on Improvement of Chip Packaging Technology

作　　者：何桂港 HE Guigang(Giga Force Electronics Co.,Ltd,Shanghai 201203,China)

机构地区：[1]上海季丰电子股份有限公司,上海201203

出　　处：《集成电路应用》2020年第7期39-41,共3页Application of IC

基　　金：上海市科技企业技术创新课题项目。

摘　　要：在目前的芯片封装过程中,从Die Bond到切割成型,要经过多道工序,需要使用多种不同类型的半导体设备,造成巨额的运行成本。由于环节过多,导致芯片封装的周期长达7天以上。因此,通过改进芯片封装工艺,寻找替代材料,精简封装流程,芯片封装最快可2h完成,极大地缩短了加工周期,对于芯片设计公司快速新品的研发,降低运营成本,增强核心竞争力有非常大的帮助。In the current chip packaging process,from die bond to cutting and forming,there are many processes,which need to use a variety of different types of semiconductor equipment,resulting in huge operating costs.Due to too many links,the cycle of chip packaging is more than 7 days.Therefore,by improving the chip packaging process,finding alternative materials,and simplifying the packaging process,the chip packaging can be completed as soon as 2h,which greatly shortens the processing cycle.It is very helpful for the chip design company to develop new products quickly,reduce the operating cost and enhance the core competitiveness.

关 键 词：集成电路制造 芯片封装 替代材料 精简流程 

分 类 号：TN405[电子电信—微电子学与固体电子学]