晶圆级封装(WLP)可靠性标准及试验方法综述  

Review of Reliability Standards and Test Methods for Wafer Level Packaging

作　　者：吉勇[1] 李杨[1] 朱家昌 朱召贤 JI Yong;LI Yang;ZHU Jiachang;ZHU Zhaoxian(The 58th Research Institute of CETC,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2020年第S01期96-99,共4页Electronic Product Reliability and Environmental Testing

摘　　要：随着晶圆级封装的广泛应用,其可靠性也受到越来越多的重视。首先,介绍了典型晶圆级封装结构,并针对该结构介绍了常见的晶圆级封装失效问题,包括芯片碎裂、再布线分层和凸点剪切力试验异常等;然后,介绍了目前国内外晶圆级封装标准的现状,指出目前仅有部分标准涉及晶圆级封装,缺少针对性标准;最后,通过对国内外军民领域考核标准的分析,给出了典型的晶圆级封装考核方法,对今后晶圆级封装的可靠性考核方法的制定及可靠性提升具有一定的指导作用。With the wide application of WLP,its reliability has been paid more and more attention.First,the typical WLP structure is introduced,and the common WLP problems are introduced,including chip fragmentation,rewiring delamination,and abnormal shear force test at convex point.Then,the current status of WLP standards at home and abroad are introduced,and it is pointed out that only some of the current standards involve WLP,and the targeted standards are lacked.Finally,through the analysis of the domestic and forergn military and civilian field assessment standards,a typical WLP assessment method is given,which can guide the formulation and reliability improvement of WLP in the future.

关 键 词：晶圆级封装 失效 可靠性 考核标准 

分 类 号：TB114.3[理学—概率论与数理统计]