微流控芯片的键合技术与方法  

Bonding Techniques and Methods of Micro-fluidic Chips

作　　者：宋满仓[1,2] 吕月月 刘军山 SONG Mancang;LV Yueyue;LIU Junshan(School of Mechanical Engineering,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学机械工程学院,辽宁大连116024 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,辽宁大连116024

出　　处：《新技术新工艺》2020年第7期1-6,共6页New Technology & New Process

基　　金：国家重点研发计划资助项目(2016YFC1202503);国家科技支撑计划资助项目(2015BAI03B08)。

摘　　要：键合是将组成微流控芯片的基片和盖片以某种方式结合在一起,从而形成封闭的微通道的一种装配方法。键合质量直接影响到微通道中流体的运动形态,从而影响检测效果,因此键合是微流控芯片制作过程中非常重要的环节。综述了现有的微流控芯片键合技术和方法,分析了各种键合技术和方法在键合质量、键合效率以及操作简便性等方面的特点,为不同材质、不同应用领域的微流控芯片选择适用的键合方法提供了技术指南,对键合技术的未来发展进行了分析和预测。Bonding was an assembly method that the substrate and cover of the micro-fluidic chip were combined in a certain way,so formed enclosed micro channels.The fluid motion in the micro-channel would be affected by bonding quality directly and thus the detection results were influenced,so the bonding was a very important link in the manufacturing process of micro-fluidic chips.The existing bonding techniques and methods were summarized,and it was analyzed that the features of bonding quality,efficiency and operational simplicity in available bonding techniques and methods.Technique guidance for selecting suitable bonding methods for micro-fluidic chips with different materials and application fields were provided.In addition,the future development of bonding technology was analyzed and predicted.

关 键 词：微流控芯片 键合 键合质量 键合效率 操作简便性 

分 类 号：TN305[电子电信—物理电子学]