基于SPI检测的焊膏喷印机喷印参数研究  

Investigation on Jet Printing Parameter of Paste Based on SPI

作　　者：谢欢欢 Xie Huan-huan(China Air-to-air Missile Academic,Henan Luoyang 471000)

机构地区：[1]中国空空导弹研究院,河南洛阳471000

出　　处：《电子质量》2020年第8期80-83,共4页Electronics Quality

摘　　要：焊膏喷印技术由于其优良特点近年来得到了广泛关注,该文对回流焊中焊膏的喷印参数及喷印机理进行了探讨。以QFP、BGA、片式电阻三种典型表贴元器件为例,通过SPI检测锡膏量并进行喷印参数调整优化,确定出最优喷印工艺参数后进行正式喷印焊接,最终焊接质量良好。Paste jet printing technology receives more focus for its perfect character recently.In this paper,the printing parameters and the printing mechanism of solder paste in reflow welding are discussed.Taking QFP,BGA and chip resistor as an example,The amount of solder paste was detected by SPI and the printing parameters were adjusted and optimized to determine the optimal printing process parameters before the formal printing welding.The final welding quality is good.

关 键 词：回流焊 焊膏 喷印 表面贴装技术 SPI检测 

分 类 号：TN405[电子电信—微电子学与固体电子学]