MEMS微组装工艺研究  

Research on MEMS Micro-assembly Process

作　　者：周婷[1] 潘园园 张柯 ZHOU Ting;PAN Yuan-yuan;ZHANG Ke(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2020年第2期60-65,共6页Hybrid Microelectronics Technology

摘　　要：MEMS封装技术由集成电路封装技术发展和演变而来,但是又有其特殊性。本文分析了MEMS微组装工艺的特点,研究了表头组装工艺和产品真空封装工艺,并结合应用实例分析了关键控制点和目前存在的问题,希望对后续的研究工作有一定参考意义。MEMS packaging technology is developed and evolved from integrated circuit packaging technology,but it has its particularity.In this paper,the characteristics of MEMS micro-assembly process are analyzed,the gauge head assembly process and the product vacuum packaging process are studied,and the critical control points and the existing problems are analyzed based on the application examples.It will have certain reference significance for subsequent research work.

关 键 词：MEMS封装 真空封装 低应力 

分 类 号：TN405[电子电信—微电子学与固体电子学]