金刚石铝在微波功率组件中的应用研究  

Application of DiamondAl in Microwave Power Modules

作　　者：张眯 王从香[1] 牛通[1] 王锋[1] ZHANG Mi;WANG Congxiang;NIU Tong;WANG Feng(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2020年第4期53-56,共4页Electro-Mechanical Engineering

摘　　要：针对大功率微波组件中功率芯片对金刚石铝等新型热管理材料的应用需求,文中开展了金刚石铝表面可焊性镀层制备、功率芯片自动金锡共晶焊等工艺研究,制备了散热测试件,测试对比了在工作条件下以金刚石铝和钼铜为热沉的功率芯片模块的实际散热效果。结果表明在金刚石铝表面上制备的NiAu镀层均匀致密,附着力好,焊料在其表面铺展良好,芯片焊透率 90%;在相同条件下,与钼铜相比,金刚石铝上的芯片表面最高温度平均降低了6.3℃,具有更加优异的散热效果。Aiming at the application requirements for advanced thermal management materials such as diamondAl of power amplifier chips in high power microwave modules, preparation of solderable coating on diamondAl surface and the Au80 Sn20 automatic eutectic welding of power amplifier chip are studied in this paper. The heat dissipation test samples are prepared and the actual heat dissipation effect of both diamondAl and MoCu is tested under operating conditions. The result shows that the NiAu coating plated on the surface of diamondAl is uniform and compact and has good adhesion strength and solderability and the solder is well laid on the surface with soldering rate higher than 90%;that compared with MoCu, diamondAl has better heat dissipation performance in the same condition for the highest temperature on the surface of diamondAl decreases by 6.3℃ on average.

关 键 词：金刚石铝 可焊性 镀层 共晶焊 散热 

分 类 号：TB34[一般工业技术—材料科学与工程]