一种低插损高频导热覆铜板的研制  

Development of low insertion loss and thermal conductive Copper Clad Laminate for high frequency application

作　　者：颜善银[1] 介星迪 朱泳名 杨中强[1] Yan Shanyin;Jie Xingdi;Zhu Yongming;Yang Zhongqiang(Shengyi Technology CO.,LTD,National Engineering Research Center for Electronic Circuits Base Materials.Dongguan 523808,China)

机构地区：[1]广东生益科技股份有限公司,国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2020年第9期8-12,共5页Printed Circuit Information

摘　　要：材料的导热系数对于减小温升至关重要。此外,介电常数较低的印制电路板材料也会比介电常数较高的材料产生的损耗小、热量少。一般而言,选择具有良好性能的线路板材料,如高导热系数,较低的损耗因子,光滑的铜箔表面以及低介电常数,不仅有助于设计高性能的印刷线路板,还能够改善热管理。基于以上需求,文章介绍一种玻纤布增强的低插损高频导热覆铜板。The thermal conductivity of the material is critical for minimizing the heat rise.In addition,a PCB with low Dk will also yield less loss and less generated heat than materials with higher Dk values.In general,attention to selecting circuit material with favorable attributes,such as improved thermal conductivity,low dissipation factor,smooth copper conductor surface and low dielectric constant,can not only be helpful in the design of a high performance PCB,but also lead to improved thermal management.According to above requirement,this article mainly introduces a kind of glass fiber reinforced low insertion loss and thermal conductive CCL which is suitable for high frequency application.

关 键 词：低插损 高频 导热 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]