低温共烧陶瓷基板生产关键技术研究  

Research on Key Technology of LTCC Substrate Production

作　　者：杨靖鑫[1,2] 吴申立 麻茂生[3] 丁小聪 马涛[1,2] YANG Jing-xin;WU Shen-li;MA Mao-sheng;DING Xiao-cong;MA Tao(No.43 Research Institute,of CETC,Hefei 230088,China;Anhui Province Technical Standard Innovation Base,Hefei 230001,China;Instruments’Center for Physical Science,University of Science and Technology of China,Hefei 230026,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088 [2]安徽省技术标准创新基地,合肥230001 [3]中国科学技术大学理化科学实验中心,合肥230026

出　　处：《混合微电子技术》2019年第3期54-56,62,共4页Hybrid Microelectronics Technology

摘　　要：叙述了LTCC技术特点及未来发展趋势,介绍了LTCC产品的种类、优越性及广阔的应用前景。对LTCC工艺中的关键技术——高精度丝网印刷技术和陶瓷高温共烧技术进行了深入研究,剖析了影响印刷精度、导体表面粗糙度、LTCC基板翘曲度和陶瓷强度的工艺因素。并分析了如何根据产品布线特点来设计和优化印刷工艺参数、如何根据基板结构特点来设计和优化排肢曲线。通过大量的工艺试验和数据测试,结果表明,印刷压力影响导体精度和表面粗糙度、烧结曲线排胶段升温速率影响LTCC基板翘曲度和陶瓷强度。The characteristics and the future development trend of LTCC technology are described.The types of products,the superiority of LTCC and broad application field of LTCC technology are introduced.High precision screen printing technology and ceramics high temperature co-firing technology are studied.The technology factors are analyzed which influence the moralized printing precision,conductor surface roughness,LTCC substrate warping and intensity of ceramic.How to design and optimize the printing process parameters according to wiring characteristic,and how to design and optimize the binder removal curve according to the structure characteristics of substrate are analyzed.Through a large number of technological test and data examinations,it is concluded that the printing pressure influence moralized conductor precision and surface roughness and the heating rate of binder removal part in sintering curve for LTCC influence the substrates warping and the ceramic intensity.

关 键 词：低温共烧陶瓷 基板 丝网印刷 共烧技术 

分 类 号：TN405[电子电信—微电子学与固体电子学] TQ174.6[化学工程—陶瓷工业]