氮化铝封装外壳引脚焊接强度研究  

Study on Pin Brazing Strength of AIN Package

作　　者：钟永辉 孙刚[1] 王宁[1] 方军[1] 崔嵩[1] ZHONG Yong-hui;SUN Gang;WANG Ning;FANG Jun;CUI Song(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2019年第3期67-71,76,共6页Hybrid Microelectronics Technology

摘　　要：氮化铝陶瓷封装外壳以优异的综合性能契合了整机装备及系统级封装的需求。通过设计氮化铝陶瓷有引脚封装模型,采用拉力试验机对钎焊后的金属引脚进行垂直拉力和90°剥离力试验,分别研究了镀镍层厚度、钎料量、钎焊结构对金属引脚与陶瓷银铜共晶钎焊结合力的影响,研究表明:随着陶瓷镀镍层厚度及钎料量的增加,钎焊后的结合力有下降的趋势;不同的钎焊结构导致金属引脚受力失效模式不同,通过采用合适的焊接结构可有效地提高金属引脚的焊接可靠性。The AIN ceramic package meets the needs of the equipment and SIP with excellent overall performance.By designing the AIN ceramic with lead package model,the tensile test and the 90°peel force test are carried out on the brazed metal pins by tensile testing machine.The thickness of the nickel plating layer,the amount of solder and the brazing structure are studied respectively.The influence of the bonding force between metal pins and ceramic silvercopper eutectic brazing shows that with the increase of the thickness of ceramic nickel plating layer and the amount of brazing material,the bonding force after brazing has a tendency to decrease;different brazing structures lead to The metal pins are subjected to different failure modes,and the brazing reliability of the metal pins can be effectively improved by using a suitable brazed structure.

关 键 词：氮化铝 封装外壳 钎焊 金属引脚 强度 

分 类 号：TN405[电子电信—微电子学与固体电子学]